Flip-chip Teslin® Inlay
TESLIN® substrate is a durable, secureand highly printable synthetic paper that excels for laminated print projectsand other applications demanding a tough, high-performance material.
Pre-laminated Teslin inlay is suitable for the productionof ISO card, passport and other ticket / certificate…
It is a semi-finished product and card / ticket manufacturers merely need to directly print on them or collate the printedsheets with the inlay and laminate the “Sandwich”.
Sizes: A4,A3 (customized) …
Layout: 3 x 6, 3 x 14, 2 x 8, 2 x 6…
Thickness: 0.30| 0.35 | 0.52mm (customized)
Frequency: 13.56MHz| 860~960MHz
RFProtocol: IO14443A| ISO18000-6C,6B
Typicalchips: Temic5577 | Mifare Classic® 1K and so on
Application: card production