What Is a Teslin Flip-Chip Inlay?

A Teslin® flip-chip inlay is a semi-finished product intended for integration into compatible card and laminated-product manufacturing processes. The Teslin substrate provides a printable material platform, while the inlay construction is selected according to the intended product design and technical requirements.

Pre-laminated Teslin inlays can be used in the production of ISO cards, passports, tickets and certificates. Depending on the selected design, manufacturers can print directly on the inlay or collate printed sheets with the inlay before laminating the assembled layers.

The appropriate configuration depends on the substrate structure, chip, antenna design, sheet layout, thickness and downstream processing requirements. Confirming these details before production helps reduce specification mismatches and unnecessary adjustments on the manufacturing line.

Key product features

lTeslin® substrate for laminated print applications.

lA4 and A3 sheet sizes, with customized sizes available.

lMultiple sheet layouts for different manufacturing requirements.

l0.30 mm, 0.35 mm and 0.52 mm thickness options.

lRFID configurations selected according to the required chip, frequency and protocol.

Technical Specifications

Teslin Flip-Chip Inlay Technical Specifications

The table below summarizes the product specifications listed on the current product page. Final technical combinations should be confirmed against the selected configuration before ordering.

Technical note: Frequency, protocol and chip options must be matched to a compatible product configuration. The listed frequency ranges and chip options are not necessarily available in every combination. Please specify the exact chip model when requesting a quotation.

The appropriate thickness and sheet layout should also be evaluated against the intended finished-product structure and processing conditions.

Chip, Frequency and Configuration

Chip and Frequency Options for Different Production Requirements

Different RFID applications require different chip technologies and operating frequencies. Selecting a suitable inlay therefore involves more than choosing a substrate or sheet thickness.

When discussing your Teslin Flip-Chip Inlay requirements, please identify the target RFID technology and, where possible, the complete chip model. If the antenna design, reader system or protocol has already been specified, include those details in your inquiry.

The listed options include 13.56 MHz and 860–960 MHz configurations, with chip choices subject to confirmation. Other technical requirements can be reviewed according to the intended application and manufacturing process.

Before confirming an order, the buyer and supplier should align on:

lExact chip model and operating frequency.

lApplicable communication protocol.

lAntenna configuration, where relevant.

lSheet dimensions and card layout.

lTotal thickness and finished-product requirements.

lCompatibility with the planned lamination process.

This specification-first approach helps ensure that the selected inlay is suitable for the intended production application.

Applications

Applications in Card, Passport, Ticket and Certificate Production

Teslin Flip-Chip Inlays are intended for manufacturers producing laminated card and document products. The final configuration should be selected according to the finished product's construction, functionality and applicable requirements.

Smart Card Manufacturing

Use the appropriate inlay configuration as a semi-finished component in compatible smart card manufacturing workflows. Sheet layout, thickness and chip selection should be matched to the intended card design.

Passport and Identity Document Production

Pre-laminated Teslin inlays are listed for passport and ISO card production. Specific document projects may require additional security, regulatory and performance validation; suitability for an application does not by itself imply government approval or document-security certification.

Ticket Manufacturing

The inlay can be considered for compatible ticket production workflows in which printed layers and the inlay are assembled and laminated according to the finished-product design.

Certificate and Laminated Document Production

For suitable certificate and document applications, the inlay can form part of a laminated construction. Material selection and processing conditions should be confirmed against the intended use.

Custom Card and Document Projects

For specialized requirements, provide the target product dimensions, layout drawing, chip specification and processing details. The proposed configuration can then be reviewed against your project requirements.

Production Workflow and Compatibility

How Teslin Inlays Fit into Your Production Workflow

Pre-laminated Teslin inlays are supplied as semi-finished products for downstream manufacturing. Depending on the intended construction, manufacturers can print directly on the inlay or collate printed sheets with the inlay before laminating the assembled layers.

To evaluate compatibility with your process, consider the following steps:

1. Confirm the Product Construction

Specify the final card or document structure and determine how the inlay will be integrated into the finished product.

2. Align Sheet Dimensions and Layout

Confirm the required sheet size, layout, card positions and other dimensions relevant to your printing, lamination and cutting processes.

3. Verify Chip and Frequency Requirements

Match the chip model, operating frequency and protocol to the requirements of the target system.

4. Review Lamination Requirements

Discuss the intended layer structure and lamination conditions. Specific processing parameters should be evaluated against the selected material, chip and finished-product construction.

5. Confirm the Specification Before Bulk Production

Document the approved configuration, including the relevant technical parameters and acceptance requirements, before moving to a production order.

This workflow gives purchasing and engineering teams a clear framework for reviewing compatibility before committing to a bulk order.

Customization

Customized Teslin Inlays for Card Manufacturers

Different card manufacturers may use different sheet dimensions, layouts, thicknesses and finishing processes. Kaisere Technology can discuss customization requirements based on the intended application and requested specification.

Customization options listed for this product include sheet size and thickness. The available layouts include 3 × 6, 3 × 14, 2 × 8 and 2 × 6. Other requested configurations should be reviewed before confirmation.

When submitting a customization inquiry, please provide:

lRequired sheet size.

lPreferred layout and card dimensions.

lTarget thickness and any known tolerance requirements.

lChip model, frequency and protocol.

lIntended finished-product structure.

lPrinting, lamination or other downstream processing requirements.

lEstimated order quantity and delivery destination.

If you have an existing technical drawing or sample, include it with your inquiry. This can help clarify the required dimensions and configuration before quotation.

Manufacturing and Quality Control

Manufacturing Coordination and Quality Requirements

For B2B manufacturers, a suitable inlay must meet both technical specifications and downstream production requirements. Product selection should therefore be based on more than material name or nominal thickness alone.

Kaisere Technology works with buyers to clarify product specifications and customization requirements for RFID-related products. For Teslin Flip-Chip Inlay orders, the final configuration should be defined before production so that the product can be evaluated against the intended application.

Quality-related requirements can be discussed during the quotation and specification-confirmation process, including:

lVerification of the requested chip model, frequency and protocol.

lConfirmation of sheet dimensions, layout and thickness.

lReview of the intended lamination process and finished-product requirements.

lAgreement on applicable inspection criteria and requested documentation.

lConfirmation of packaging and batch-identification requirements, where applicable.

For projects with specific quality documentation or inspection needs, identify those requirements at the inquiry stage. The applicable inspection scope and available documents should be confirmed for the selected product configuration.

This approach helps engineering, purchasing and production teams establish clear acceptance requirements before committing to volume supply.

Manufacturing Capability and Supplier Background

A Manufacturing Partner for RFID Product Buyers

Kaisere Technology serves B2B customers seeking RFID cards, labels, tags and customized RFID-related products. Established in 2003, the company supports international buyers across a range of RFID product categories.

The company's broader manufacturing resources include a 10,000 m² factory area and monthly production capacity of more than 12 million RFID products across its product portfolio. Kaisere Technology serves customers in more than 100 countries.

For Teslin Flip-Chip Inlay projects, product availability, configuration, production planning and delivery schedules should be confirmed against the requested specifications and order quantity.

For purchasing teams evaluating a potential long-term supplier, relevant discussion points include:

lProduct configuration and customization scope.

lTechnical documentation requirements.

lInspection and sample-approval expectations.

lBulk order quantities and replenishment plans.

lPackaging and international shipping requirements.

The objective is to establish a clear technical and commercial basis for the order before production begins.

Global Supply and Order Planning

Global Supply Support for B2B Buyers

International procurement requires clear communication of product specifications, packaging requirements, delivery destinations and shipment terms.

When requesting a quotation for Teslin Flip-Chip Inlay, provide the destination country, estimated quantity and any required shipping or documentation instructions. This helps the supplier review the order requirements and confirm the applicable delivery arrangements.

Production lead time, minimum order quantity, packaging specifications and shipping terms should be confirmed in the quotation because they may depend on the selected configuration, order volume and destination.

For repeat orders, maintaining an approved product specification and agreed acceptance criteria can help purchasing teams communicate requirements more consistently across replenishment orders.

Procurement Guide

How to Request a Teslin Flip-Chip Inlay Quotation

To help us review your requirements, please include the following information in your inquiry.

If some details are not yet available, submit the information you have. Our team can review the initial requirement and identify which technical details need to be confirmed before a final quotation.

Final Conversion Section

Looking for a Teslin Flip-Chip Inlay Supplier?

Share your target card or document application, preferred sheet dimensions, layout, thickness and chip requirements with Kaisere Technology.

We can review the requested specification and discuss suitable product configurations, customization requirements and quotation details for your project.

Whether you are evaluating a new design or planning a repeat order, providing clear technical requirements is the first step toward a reliable supply arrangement.

Frequently Asked Questions

1. What is a Teslin Flip-Chip Inlay?

A Teslin Flip-Chip Inlay is a semi-finished component intended for compatible card and laminated-document manufacturing. The listed product uses TESLIN® material and is intended for applications including ISO cards, passports, tickets and certificates. The exact construction should be confirmed for the selected configuration.

2. What sheet sizes are available?

The listed standard sheet sizes are A4 and A3. Customized sizes can also be discussed according to your production requirements. Please provide the target dimensions and layout when requesting a quotation.

3. Which layouts are available?

The current product specification lists 3 × 6, 3 × 14, 2 × 8 and 2 × 6 layouts. If your production process requires another arrangement, provide a drawing or dimensional specification for review.

4. What thickness options are available?

The listed thickness options are 0.30 mm, 0.35 mm and 0.52 mm. Customized thickness requirements can be discussed. Confirm the required thickness and any applicable tolerance against your finished-product structure before ordering.

5. Which frequencies and protocols does the inlay support?

The product page lists 13.56 MHz and 860–960 MHz frequency options, together with ISO 14443A, ISO 18000-6C and ISO 18000-6B protocol references. The applicable frequency and protocol depend on the selected chip and inlay configuration and should be confirmed before ordering.

6. Which chip models are available?

The current page lists Temic 5577, MIFARE Classic 1K and other chip options. Availability and technical compatibility should be confirmed against the complete chip model, operating frequency and required protocol for your application.

7. Is the inlay suitable for passport, ticket and certificate production?

The listed product is intended for ISO card, passport, ticket and certificate production. Final suitability depends on the specific document construction, manufacturing process, security requirements and applicable regulations.

8. Can the inlay be integrated into our existing production process?

The listed pre-laminated product can be used in workflows where manufacturers print directly on the inlay or collate printed sheets with the inlay before lamination. The required configuration and processing conditions should be reviewed against your actual production process.

9. Can I request a custom inlay configuration?

Customized sheet sizes and thicknesses are listed as available. Other configuration requirements can be discussed based on your drawing, chip model, layout and intended finished product. Final availability should be confirmed before placing an order.

10. Can samples be evaluated before a bulk order?

Sample evaluation can be discussed during the inquiry process, depending on the required configuration and sample availability. Share your specifications and intended manufacturing process so the appropriate evaluation requirements can be reviewed.

11. What quality documents can be provided?

Please identify the documents required for your purchasing or quality-assurance process, such as technical specifications or applicable inspection records. The availability and scope of documentation should be confirmed for the selected product configuration.

12. How can I request a quotation?

Provide your required sheet size, layout, thickness, chip model, frequency, target application, estimated quantity and delivery country. If you do not have every specification available, submit the information you have so that the remaining requirements can be identified during technical review.